Graphene has long been regarded as one of the most promising materials for future electronics, but its relatively weak ...

An international research collaboration has developed a new molecular strategy for controlling one of the most critical ...

Using bird bone structure as inspiration, Xin Ning and Sepideh Ebad Sichani, Ph.D. '26, have created a new class of aircraft ...

As interest in clean hydrogen power grows, so does the need for safe storage and transportation materials. One such material, vanadium, is a leading candidate because it readily absorbs hydrogen and ...

Scientists from Southampton and Singapore have unveiled a new fabrication technique for the ultra-clean manufacturing of 2D ...

Advanced semiconductor devices depend on intricate 3D architectures made up of diverse material layers, each critical to overall chip performance. The most popular methods for characterizing these ...

Researchers at Cornell University have developed a powerful imaging technique that reveals atomic scale defects inside computer chips for the first time. Using an advanced electron microscopy method, ...

This image shows the silicon, silicon dioxide, and hafnium oxide layers inside a transistor channel. Credit: Cornell University A stunning new imaging breakthrough lets scientists see — and fix — the ...

Scientists working at microscopic scales have relied on a single dominant fabrication technique to build complex 3D structures. Two-photon polymerization made it possible to sculpt objects far thinner ...

The post Paleogene tectonic activities in the Levant comprising emergence of the Levant area from the Tethys Sea (epirogenic uplifts), the continuous drifting apart of the Arabian Plate from the ...

Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications. Released every 12 to 18 months, 3D NAND scaling outpaces ...

Abstract: Through-silicon via (TSV) as a crucial interconnection microstructure in three-dimensional (3D) chip, have significantly enhanced device performance and reliability. However, the increasing ...