Highly filled liquid epoxy for smaller, more reliable chip packaging

As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In ...

Like a cheat code for your car: We investigate ECU tuning

As modern vehicles become increasingly software-driven and OEMs continue to tighten security, the company has had to work ...
Semiconductor Engineering

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...
GitHub

A most Frontend Collection and survey of vision-language model papers, and models GitHub repository

WeGen: A Unified Model for Interactive Multimodal Generation as We Chat 2025 📄 Paper-💾 Code VideoMind: A Chain-of-LoRA Agent for Long Video Reasoning 2025 📄 Paper 🌍 Website 💾 Code AHA: A ...
MIT Technology Review

DeepSeek may have found a new way to improve AI’s ability to remember

Instead of using text tokens, the Chinese AI company is packing information into images. An AI model released by the Chinese AI company DeepSeek uses new techniques that could significantly improve AI ...
marktechpost

IBM and Hugging Face Researchers Release SmolDocling: A 256M Open-Source Vision Language Model for Complete Document OCR

Converting complex documents into structured data has long posed significant challenges in the field of computer science. Traditional approaches, involving ensemble systems or very large foundational ...
Frontiers

Mechanical properties of mudstone caprock and influencing factors: implications for evaluation of caprock integrity

Mudstone is the most common cap rock in petroliferous basins. The mechanical properties of mudstone in different areas and buried depths are obviously different, which directly affects the brittleness ...