Power Tips #154: Finding the thermal and current limits of high-power GaN devices through simulation
High power density power-supply modules based on gallium nitride (GaN) devices are core components in the automotive, industrial and data-center sectors. As their integration level and power density ...
This work identifies long-lived chiral quasiparticles emerging on top of periodically reviving scarlike states in a Rydberg atom chain at high energy densities where instead thermalization is expected ...
A fixed-free rod is heated uniformly by an amount of ΔT. The rod experiences axial and transverse strains due to temperature increase; however, no stress is developed since the right end of the rod is ...
Abstract: The continuous advancement of semiconductor processes has led to increasingly prominent leakage power issues in integrated circuits (ICs), making leakage-aware nonlinear thermal simulation a ...
Mark Cussen, CMFC, has 13+ years of experience as a writer and provides financial education to military service members and the public. Mark is an expert in investing, economics, and market news.
Abstract: The explosive growth of AI workloads elevates on-chip communication and heat dissipation to first-order constraints. This survey paper consolidates thermal-aware Network-on-Chip (NoC) design ...
After resisting 150 bombing runs by the Allies in the Second World War, the cisterns continued to be used by the Italian Air Force to hold aviation fuel.
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