Thermocomp OFM76XXP and OFM76EXP compounds deliver enhanced thermal stability, impact strength, and flame retardancy for ...
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Power Tips #154: Finding the thermal and current limits of high-power GaN devices through simulation
High power density power-supply modules based on gallium nitride (GaN) devices are core components in the automotive, industrial and data-center sectors. As their integration level and power density ...
Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
Abstract: Higher switching speed requires power module package to have lower parasitic inductance. This article summarized three methods to realize low parasitic inductance. Based on these methods, ...
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