Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a ...

What are the 2 categories of mounting method in IC packaging? Describe these categories and its package types. The final step in IC fabrication is packaging the device in a suitable medium that can ...

The packaging industry continues to emphasize sustainability, but identifying areas for improvement remains a priority. There are several options for packaging producers looking to make their products ...

For example, if a MOSFET in an SO8 package (θ JD = 15°C/W) dissipates a P j of 1 W and must maintain a junction temperature below 125°C, then the measured drain temperature must not exceed 110°C ...

For the PDF version of this article, click here. As the dc-dc conversion industry proceeds toward the demand for improved power density and efficiency, thermally enhanced packages with SO-8 footprints ...