Last time, we talked about single-PCB-design panels, all the cool aspects of it, including some cost savings and handling convenience. Naturally, you might wonder, and many did – can you put multiple ...

What makes up a multi-die/chiplet system? What’s driving demand for multi-die systems? The challenges of multi-die system design. Demands have never been higher for—and on—semiconductors. From smart ...

Semiconductor design is in the midst of a structural shift. For decades, performance gains were achieved by packing more transistors into single, monolithic dies. But the physical limitations of these ...

The continued unbundling of SoCs into multi-die packages is increasing the complexity of those designs and the amount of design data that needs to be managed, stored, sorted, and analyzed. Simulations ...

Whilst chiplets garner much interest, many remain cautious about adopting multi-die solutions because the technology ...

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...

Server and computer system architecture has increased in tandem with power delivery (PD) requirements in recent decades. This complicates regulator design since it necessitates a compromise between ...

Abhijeet Chakraborty, Vice President of Engineering at Synopsys, presented one of the keynote speeches at the 2024 Chiplet Summit (watch the video above). Mr. Chakraborty noted that 2023 was an ...