Aiming to eliminate obstacles to its roadmap, Intel Corp. this week is unveiling its “bumpless buildup layer” packaging technology designed to handle the constraints of the company's 20GHz processor.

Intel on Monday is unveiling an entirely new design for the silicon and metal vehicles that connect the microprocessor to the rest of the computer. That may sound arcane, but the oft-overlooked art of ...

Intel has today announced a new packaging technology that will help the company build processors with more than a one billion transistor count at about 20GHz in the next few years. The technology is ...

The company is unveiling an entirely new design for the silicon and metal vehicles that connect the microprocessor to the rest of the computer. Michael Kanellos is editor at large at CNET News.com, ...

Intel Corp. researchers have developed a new technology that the company hopes will let chips reach speeds of 20GHz in the second half of this decade. The technological advance is not in the ...

Intel Labs has developed an ultrathin packaging technique for processors that can help reduce the amount of noise seen on power supply lines and so cut the amount of power the chips inside draw. Intel ...

eWEEK content and product recommendations are editorially independent. We may make money when you click on links to our partners. Learn More. Intel Corp. researchers have developed a new technology ...

Computer chip maker Intel said this week it has created a system of connecting computer chips to the rest of the computer that… Computer chip maker Intel said this week it has created a system of ...