This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). The information in this application note can be used throughout the various stages of WLCSP use. This ...

Aehr Test Systems (NASDAQ:AEHR) used a recent presentation to outline its position in semiconductor reliability testing, with ...

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

FREMONT, CA / ACCESS Newswire / November 12, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced the shipment of its Dual-Echo™ ...

Aehr Test Systems (NASDAQ:AEHR) executives said the company made “significant progress” across both wafer-level and ...

STMicroelectronics, STATS ChipPAC, and Infineon Technologies have agreed to jointly develop the next generation of embedded wafer-level ball-grid array (eWLB) technology. The R&D effort will focus on ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...