Next-generation Semiconductor Company Syenta Raises $26 Million in Series A Funding to Deliver Breakthrough Chip-to-Chip Connectivity for AI

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...
Nasdaq

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

To support the increasing demand for scalable electromagnetic analysis, Ansys is introducing a new HFSS-IC product family. HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its ...
Nasdaq

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

yieldWerx and Enlight Technology Extend Design-to-Test Data Continuity Across Taiwan's Semiconductor Ecosystem

Werx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world's most ...
Business Wire

UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era

UMC's 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices. UMC's innovative 3D IC technology addresses the challenge ...
VentureBeat

TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.
EDN

A crash course in 3D IC technology

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...
Semiconductor Engineering

What Is 3D-IC Technology? Fundamentals, Architecture, And Design Concepts

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
DATAQUEST

Groundbreaking of India’s first advanced 3D semiconductor packaging unit in Odisha

Odisha poised to power PM Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing: Chief ...
Asianet Newsable on MSN

Odisha enters global semiconductor race with 3DGS chip packaging unit

Odisha takes a major leap into the global semiconductor value chain with the groundbreaking for 3D Glass Solutions Inc.'s ...
EDN

One-stop advanced packaging solutions for chiplets

The chiplet design movement is gathering steam, and the availability of one-stop advanced packaging solutions is a testament to this semiconductor technology’s advancement toward mass production. Such ...