The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...
Today 's problems in chip design are related to flow, not tools.Building an in-house flow — the successful interplay of tools, data and people — has become increasingly difficult because there aren't ...
Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...
Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved. But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a ...
Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Ciranova, Inc., a leader in automated physical design for analog and mixed-signal ICs, announced today that its Ciranova Helix® custom IC layout automation ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--ATopTech, the leader in next generation physical design solutions, today announced that Aprisa™ and Apogee TM, the company’s place and route solution, are ...
IROC Technologies was tasked by the European Space Agency (ESA) to assess the suitability of Ultra Deep Submicron (UDSM) technology nodes below 22 nm for space applications. IROC set out to build a ...
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