Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

V-Chip, a subsidiary of Sai Microelectronic, has established a new IC design facility in Penang in September 2025.

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

Analysts estimate that the global market for semiconductors will exceed $600 billion in 2025 and hit the $1 trillion mark by 2030, suggesting a CAGR of over 8%. It’s no surprise that the drivers ...

Collectively, the startup’s founding team has 10 decades of experience in chip design, AI applications and product development at Texas Instruments, Qualcomm and other global companies, alongside 70 ...

A new software combines connectivity, scalability and data-driven artificial intelligence (AI) capabilities to push the boundaries of the IC verification process and make chip design teams more ...

The Design Linked Incentive Scheme is accelerating India’s move into high-value semiconductor design. The key takeaway is rapid progress from ideas to silicon, backed by incentives, shared ...

Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also brings greater complexity and ratchets up the number of design decisions ...

The Trump administration's decision to allow Nvidia's H20 chips back into China has triggered a surge of urgent orders from major Chinese cloud providers, reviving not only Nvidia's outlook but also ...

The White House has finally released details regarding chip tariffs. Despite previous concerns, tariff rates and products ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...