Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...

With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

Hamilton's in-line cell density sensors have found application in various customer scenarios, spanning from feed control to continuous processing. This eBook offers a concise compilation of pertinent ...

Schaumburg, Ill. — Omron Electronic Components LLC has introduced the G5T series of slim power PCB relays in a 7.0 x 20.4 x 15.0-mm (WxLxH) footprint, making them suitable for high-density ...

Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...

When it comes to counting people—just counting people, not tracking Wi-Fi or Bluetooth signals from mobile phones to serve up advertising and to use as a proxy for crowd size—there are not many highly ...

Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...