HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

In this interview, Mark Bumiller, Technology Manager for Entegris talks to AZoM about using the Accusizer to detect large particles counts in CMP slurries. Please could you give us an introduction to ...

Chemical mechanical polishing (CMP) of silicon carbide (SiC) is an essential process in the fabrication of high-performance semiconductor devices. SiC is prized for its exceptional hardness, thermal ...

As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...

Applied Materials Inc. today announced Reflexion LK, what it said is the industry's only low down force chemical mechanical polishing (CMP) system that planarizes low k and ultra-low k dielectric ...