The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

Alchip Technologies, Ltd., the high-performance AI and HPC ASIC leader, will showcase its latest technology advancements at the Partner Pavilion of the TSMC 2026 Technology Symposium in North America.

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

Physical AI systems, which enable machines to perceive, analyse and respond to real‑time environments, are increasingly being ...

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

Chiplet PHY Designer 2025 from Keysight offers simulation capabilities for UCIe 2.0 and support for the Open Compute Project Bunch of Wires (BoW) standard. Tailored to AI and data center applications, ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

Taking advantage of IP such as processors and network-on-chips (NoCs) allows designers to quickly configure and build chiplet ...

The semiconductor industry is moving out of the monolithic age of the system-on-chip (SoC). Instead of arranging every building block of IP on the same slab of silicon, the movers and shakers in the ...

As AI processor design shifts to systems level, Alchip Technologies says its 3DIC platform is driving more efficient development of next-generation AI and high-performance computing devices through ...

Rigetti Computing RGTI recently announced the general availability of its 108-qubit quantum system, Cepheus-1-108Q, marking a ...

Apple M5 Pro and M5 Max chips could debut at Apple’s upcoming event on March 4th and power the new MacBook Pro models. Both chips could offer more CPU and GPU cores, courtesy of a new chiplet design.