Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...

An AI algorithm converts 2D electron microscope images into accurate 3D structures, cutting analysis time and cost to one-eighth while preserving precision. The newly developed algorithm requires ...

In a recent study published in the journal Nature Methods, a group of researchers developed a novel method called Ribonucleic Acid (RNA) High-Order Folding Prediction Plus (RhoFold+). This deep ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

An international team of researchers from LMU and the Helmholtz Centre for Infection Research has visualized the structure of the so-called ASC speck. A central component of the human immune system, ...

Adient has been granted a patent for a body-supporting component featuring a main body with a 3D lattice structure. This design incorporates deflection properties and is made from a flexible material, ...